一、个人基本情况

何艳，女，副教授，博士。

二、学习、工作经历

三、学术兼职

辽宁石油化工大学学报青年编委

四、研究方向

精密加工与特种加工、半导体材料的高效加工技术、机械部件的摩擦学和磨损分析、纳米制造

五、研究生招生专业

机械工程等相关专业

六、主要业绩

无

七、近期主持的主要科研项目

1、辽宁省联合计划基金项目/面上项目“光电-超声复合抛光氮化铝衬底材料原子级光滑表面多场耦合作用机制与损伤调控研究”（主持）

2、辽宁省教育厅高校基本科研项目/青年科学家项目“光电改性-超声辅助高效抛光氮化铝衬底技术及机理研究（编号. LJ212410148026）”（主持）

3、辽宁省博士科研启动基金计划项目“超声振动-光催化复合辅助抛光碳化硅晶体机理及损伤研究（编号. 2022-BS-292）”（主持）

4、辽宁省教育厅科学技术研究项目“电助光催化抛光单晶碳化硅机理及损伤研究（编号. LJKZ0383）”（主持）

5、辽宁石油化工大学引进人才科研启动基金“光催化辅助抛光单晶碳化硅技术与机理（编号. 2020XJJL-012）”（主持）

八、代表作

[1]He Yan^*, Yue Shankuo, Tang Wenzhi, et al. Microscopic removal behavior and damage of single-crystal silicon carbide under different motion forms of diamond abrasive particle[J]. Physica Scripta, 2025, 100(7): 075401. (SCI: 001502954400001, Q2, IF=2.6)

[2]Zhou Guanxu, He Yan^*, Tang Meiling, et al. The influence mechanism of the nano-cutting direction on the edge atomic arrangement characteristics of graphene nanoribbons[J]. Physica Scripta, 100(10): 105403. (SCI: 001593275400001, Q2, IF=2.6)

[3]He Yan^*, Wang Kaiyuan, Tang Meiling, et al. Tensile behaviorand mechanica properties ofsingle-crysta AlNunder uniaxia tension loading[J]. Physica Scripta, 2025, 100(11): 115402. (SCI Q2, IF=2.6)

[4]He Yan^*, Wang Kaiyuan, Tang Meiling, et al. Study on the uniaxial tensile mechanical behavior of two-dimensional single-crystal aluminum nitride[J]. Physica Scripta, 2024, 99(12): 125403. (SCI: 001349708800001, Q2, IF=2.6)

[5]He Yan^*, Zhou Guanxu, Tang Meiling, et al. Investigation on mechanism of mechanical activation and chemical reactions in CMP of diamond assisted by hydroxyl free radicals[J]. Applied Surface Science, 2024, 681: 161527. (SCI: 001343525800001, Q1, IF=6.9)

[6]Ma Jinyin, Wang Kaiyuan, Tang Meiling, He Yan^*, et al. Effect of monovacancy defects on anisotropic mechanical behavior of monolayer graphene: A molecular dynamics study[J]. Diamond and Related Materials, 2024, 148: 111437. (SCI: 001285711100001, Q2, IF=5.1)

[7]Fan Lin, Wang Dexi, Yu Honglei, Guo Jinyuan, He Yan^*. Amorphous-dominated MgO hollow spheres enhanced fluoride adsorption: Mechanism analysis and machine learning prediction[J]. Journal of Chemical Physics, 2025, 162(1): 014702. (SCI: 001390836200012, Q2, IF=3.1)

[8]Fan Lin, Wang Dexi, Yu Honglei, Gong Ze, He Yan^*, Guo Jinyuan. Application of machine learning to predict the fluoride removal capability of MgO[J]. Journal of Environmental Chemical Engineering, 2025, 13(1): 115317. (SCI: 001397532900001, Q1, IF=7.2)

[9]Fan Lin, Yu Honglei, He Yan^*, et al. Optimization and interpretability analysis of machine learning methods for ZnO colloid particle size prediction[J]. ACS Applied Nano Materials, 2025, 8(6): 2682-2692. (SCI: 001412188500001, Q2, IF=5.5)

[10]Yan He^*, Zikai Gao, Meiling Tang, et al. Characteristics of atomic removal and mechanism of damage formation in vibration-assisted nano cutting of copper-nickel alloy[J]. Materials Today Communications, 2024, 38: 107668. （SCI：001133493000001, Q2, IF=4.5）

[11]Yan He^*, Zikai Gao, Meiling Tang, et al. Study on the atomic removal behavior and damage formation mechanism of nano cutting copper–nickel alloy with diamond tool [J]. Modelling and Simulation in Materials, 2024, 32(3): 32(3): 035011. （SCI：001163603200001 “热点论文”与“高被引论文” Q3, IF=2.4）

[12]Yan He^*, Wenzhi Tang, Peng Gao, et al. Nano-polishing characteristics in vibration-assisted CMP of single-crystal silicon carbide via molecular dynamics simulations[J]. Materials Science in Semiconductor Processing, 2023, 164: 107637. （SCI: 001014715300001, Q2, IF=4.6）

[13]Yan He^*, Jingting Sun, Peng Gao, et al. Atomic removal mechanism of nano polishing for single-crystal AlN substrate via molecular dynamics[J]. Materials Science in Semiconductor Processing, 2023, 156: 107294. (SCI: 000918309200001, Q2, IF=4.6)

[14]Yan He^*, Meiling Tang, Lin Fan, et al. Investigation of the atomistic behavior in nanofinishing single-crystal aluminium nitride with hydroxyl radical •OH environment[J]. Computational Materials Science, 2022, 214: 111770. (SCI: 000632795800002, Q2, IF=3.3)

[15]Yan He^*, Zewei Yuan, Meiling Tang, et al. Mechanism of chemical and mechanical mutual promotion in photocatalysis-assisted chemical mechanical polishing for single-crystal SiC[J]. Proceedings of the Institution of Mechanical Engineers, Part C: Journal of Mechanical Engineering Science, 2022, 236(24): 11464-11478.(SCI: 000840244700001, Q3, IF=1.7)

[16]Yan He^*, Zewei Yuan, Shuyuan Song, et al. Investigation on Material Removal Mechanisms in Photocatalysis-Assisted Chemical Mechanical Polishing of 4H-SiC Wafers[J]. International Journal of Precision Engineering and Manufacturing, 2021, 22(5): 951-963. (SCI: 000632795800002, Q2, IF=3.6)

[17]Yan He, Zewei Yuan, Kai Cheng, et al. Development of Electrical Enhanced Photocatalysis Polishing Slurry for Silicon Carbide Wafer[J]. Proceedings of the Institution of Mechanical Engineers, Part J: Journal of Engineering Tribology, 2020, 234(3): 401-413. (SCI: 000483297100001, Q2, IF=1.8)

[18]Gao Xingjun, Li Xiang, He Yan^*, et al. Investigation on Electrical Enhanced Photocatalysis Polishing of Single-Crystal Silicon Carbide Substrates[J]. International Journal of Precision Engineering and Manufacturing, 2022, 23(11): 1261-1274. (SCI: 000853473300002, Q2, IF=3.6)

[19]Fan Lin, Deng Zilong, He Yan^*, et al. The effects of micro-texture shape on serrated chip geometry in the hardened steel AISI D2 cutting process[J]. Surface Topography-Metrology And Properties, 2022, 10(1): 015031. (SCI: 000765957800001, Q2, IF=2.4)

[20]何艳，苑泽伟，段振云，等．单晶碳化硅晶片高效超精密抛光工艺[J]．哈尔滨工业大学学报，2019，51（1）：115-121．（EI 检索号：20191306701036）

[21]何艳，苑泽伟，段振云，等．单晶SiC的电助光催化抛光及去除机理研究[J]．中国机械工程，2020，31（4）：403-409．（EI 检索号：21449769）

[22]Zewei Yuan, Yan He, Quan Wen, et al. Environment-Friendly Chemical Mechanical Polishing Slurry for SiC Wafer[J]. Materials Science Forum. 2016, 874: 415-419. (EI 检索号：20164302933068)

[23]张超，岳善廓，何艳，等. 面向铜镍合金车削加工的微织构CBN刀具研究[J].辽宁石油化工大学学报，2025，45(04)：70-79.

[24]何艳，李翔，高兴军，等. 基于Python语言的超薄金刚石切割片建模与SiC晶片切割仿真[J].金刚石与磨料磨具工程，2023，43(05)：621-631.

[25]王一凡，唐文智，何 艳^*，等. 金刚石磨粒纳米加工单晶碳化硅非连续表面机理研究[J]. 金刚石与磨料磨具工程，2024，44(01)：1-9.

[26]杨宇飞，李翔，何艳，等. 单磨粒金刚石微切削碳化硅晶体仿真与实验研究[J].金刚石与磨料磨具工程，2024，44(04)：495-507.

[27]何艳，徐子成，李萍，等. 基于ABAQUS的微织构刀具切削钛合金仿真研究[J]. 辽宁石油化工大学学报，2024，44(03)：61-69.

[28]何艳，苑泽伟，王坤，等．基于金刚石微粉的单晶蓝宝石CMP工艺研究[J]．机械设计与制造，2017，(S1)：95-97+101

[1]何艳，苑泽伟，王坤，等．单晶蓝宝石高效超精密加工技术研究[J]．组合机床与自动化加工技术，2018，(02)：136-139.

[2]苑泽伟，何艳，郑鹏，等．利用光催化氧化作用精密可控切割石墨烯带的方法与装置. 国家发明专利，专利号：ZL201710293060.0，2019.1授权．

[3]Zewei Yuan, Yan He, Zhuji Jin, et al. Prediction of the Interface Temperature Rise in Tribochemical Polishing of CVD Diamond[J]. Chinese Journal of Mechanical Engineering, 2017, 30(2): 310-320. (SCI: 000399019800010, Q1, IF=4.5)

[4]Zewei Yuan, Yan He, Xingwei Sun, et al. UV-TiO₂ photocatalysis-assisted chemical mechanical polishing 4H-SiC wafer[J]. Materials & Manufacturing Processes, 2018, 33(11): 1214-1222. (SCI: 000430424000009, Q2, IF=4.7)

[5]Zewei Yuan, Yan He, Kai Cheng, et al. Effect of Self-developed Graphene Lubricant on Tribological Behaviour of Silicon carbide/Silicon nitride interface[J]. Ceramics international, 2019, 45: 1011-1022. (SCI: 000465058500067, Q1, IF=5.6)

[6]Zewei Yuan, Kai Cheng, Yan He, et al. Investigation on smoothing silicon carbide wafer with a combined method of mechanical lapping and photocatalysis assisted chemical mechanical polishing[C]. ASME 2018 13th International Manufacturing Science and Engineering Conference, 2018, 4. (SCI: 000451241400002).

[7]Shuyu Guo, Lin Fan, Yan He, et al. The influence of microtexture tools on the geometric morphology of serrated chips based on stress triaxiality[J]. Industrial Lubrication and Tribology, 2023: 708677. (SCI: 000451241400002, Q4, IF=1.8).

[8]Meiling Tang, Zewei Yuan, Yan He, et al. Cooperative roles of mechanical behavior and chemical reactions in mechanical chemical nano cutting of graphene assisted by ·OH radicals: quantum mechanics and reaction molecular dynamics simulations[J]. Physica Scripta, 2023, 99(1): 015405. (SCI: 001127895300001, Q2, IF=2.6).

九、联系方式

联系电话：15909835060

E-mail: 1422017226@qq.com